Organic PGA packaging-a performance comparison with ceramic PGA

Abstract

The current trend in the microprocessor industry is towards high performance devices, which poses challenges to package designers to deliver excellent package performance at reasonable costs. The development of a multi-layer plastic pin-grid array (PPGA) package as a reliable, cost effective replacement to ceramic PGA is presented. Package design aspects as well as choice of materials for enhanced performance are discussed. The primary focus is on the numerical modeling and characterization of thermal performance differences between ceramic and plastic PGA packaging. Differences in mechanical and electrical performance between plastic PGA and ceramic PGA packages are also highlighted in this paper.