Electromagnetic Domain Decomposition for Through-Hole Mounting Connectors Models

Abstract

In this work, we apply electromagnetic domain decomposition (EDD) to separate through-hole mounting (THM) connector models into two sub-domains: the connector body and the PCB section. The sub-domain models were simulated and then concatenated in order to get the whole connector response. Frequency and time-domain validation was performed by comparing the S-parameters and time-domain impedance profile corresponding to full-domain and concatenated models respectively, obtaining excellent correlation results.