Topology Optimized Phase Change Material Integrated Heat sinks and Validation

A. Vargas, D. Huitink, A. Iradukunda, C. Eddy
{"title":"Topology Optimized Phase Change Material Integrated Heat sinks and Validation","authors":"A. Vargas, D. Huitink, A. Iradukunda, C. Eddy","doi":"10.1109/ITherm45881.2020.9190539","DOIUrl":null,"url":null,"abstract":"Additive manufacturing and topology optimization algorithms have provided a springboard for heat sink development in novel cooling schemes. Here, phase change material (PCM) integrated heat sinks have been constructed using direct metal laser sintering (DMLS) of AlSi10Mg alloy in a two-tier design, incorporating topology optimized fin structures for conducting heat both to the PCM within the tier, as well as to the 2nd tier, where forced air cooling removes energy from the structure. As such, energy removal balancing can be achieved for ameliorating transient power spikes in an electronic package, while maintaining a lower fan power in the air channel. To validate this thermal performance, an experimental testbed was constructed to evaluate these multimode cooling heat sinks, under various heat dissipation and fan power conditions. Sugar alcohol PCMs are evaluated in this effort for passively absorbing a portion of the total heat load in an electronic package heater analog.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITherm45881.2020.9190539","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Additive manufacturing and topology optimization algorithms have provided a springboard for heat sink development in novel cooling schemes. Here, phase change material (PCM) integrated heat sinks have been constructed using direct metal laser sintering (DMLS) of AlSi10Mg alloy in a two-tier design, incorporating topology optimized fin structures for conducting heat both to the PCM within the tier, as well as to the 2nd tier, where forced air cooling removes energy from the structure. As such, energy removal balancing can be achieved for ameliorating transient power spikes in an electronic package, while maintaining a lower fan power in the air channel. To validate this thermal performance, an experimental testbed was constructed to evaluate these multimode cooling heat sinks, under various heat dissipation and fan power conditions. Sugar alcohol PCMs are evaluated in this effort for passively absorbing a portion of the total heat load in an electronic package heater analog.
拓扑优化相变材料集成散热器及验证
增材制造和拓扑优化算法为新型冷却方案的散热器开发提供了一个跳板。本文采用AlSi10Mg合金的直接金属激光烧结(DMLS)在两层设计中构建了相变材料(PCM)集成散热器,结合拓扑优化的翅片结构,将热量传导到层内的PCM和第二层,在第二层,强制空气冷却从结构中去除能量。因此,可以实现能量去除平衡,以改善电子封装中的瞬态功率尖峰,同时保持空气通道中的较低风扇功率。为了验证这种散热性能,建立了一个实验测试平台,在不同的散热和风扇功率条件下评估这些多模式散热散热器。本研究评估了糖醇PCMs在电子封装加热器模拟中被动吸收总热负荷的一部分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信