Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications

Abstract

An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.