Devices with Te-doped InGaP layers

R. Kúdela, D. Gregušová, R. Stoklas
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Abstract

Highly n-type doped and several nanometres thick layers are necessary for various device structures, especially HEMTs. We studied delta doping In1-XGaXP ternary with tellurium, the layers were grown by MOVPE. A low growth temperature of 560 °C was used to restrict the influence of diffusion, and diethyltellurium was used as the precursor. A maximum Hall sheet concentration of 2.75×1013 cm-2 was achieved. Very thin HEMT structures with high conductivity and HEMTs were prepared using the In1-XGaXP barriers doped with tellurium.
掺te InGaP层器件
对于各种器件结构,特别是hemt,需要高n型掺杂和几纳米厚的层。本文研究了碲在In1-XGaXP三元体系中的δ掺杂。采用560℃的低生长温度限制扩散的影响,以二乙基碲为前驱体。霍尔片的最大浓度为2.75×1013 cm-2。利用掺杂碲的In1-XGaXP势垒制备了具有高导电性的超薄HEMT结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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