Portable Multimedia SoC Design: a Global Challenge

Maurizio Paganini, Georg Kimmich, Stephane Ducrey, Guilhem Caubit, Vincent Coeffe
{"title":"Portable Multimedia SoC Design: a Global Challenge","authors":"Maurizio Paganini, Georg Kimmich, Stephane Ducrey, Guilhem Caubit, Vincent Coeffe","doi":"10.1109/DATE.2007.364395","DOIUrl":null,"url":null,"abstract":"The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrated in a single device to the point that almost everything seems possible. In reality the difference between a successful design and a failure resides today more then ever in the ability of the design team to properly master all the critical design factors at once. In essence, today's system on chip design represent a multidiscipline challenge that spans from architecture through design to test and finally mass production. SoC design for portable applications has to cope with very unique constraints that normally greatly challenge the ability of an organization and most of the times of an entire company to fully master its industrialization capabilities and pushes concurrent design to new limits. In the end, only a well thought out Architecture followed by best practices design techniques with a high level of understanding of the manufacturing constraints and excellent logistics can result in a device that can be produced in the volume required by the cell phone industry today. This paper will try to capture how these challenges have been addressed to design the family of Application Processing Engines named Nomadiktrade. The paper will specifically focus on the third generation device labeled STn8815S22 where the integration capabilities of silicon technology have been pared with those of System in Package design to provide and extremely compact and effective System on Chip for portable multimedia applications. An overview of the main success factors and challenges will be presented driving the reader from the Architecture conception through the chip industrialization. Both silicon design and packaging design will be illustrated, highlighting those techniques that made this incredible product a reality","PeriodicalId":298961,"journal":{"name":"2007 Design, Automation & Test in Europe Conference & Exhibition","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Design, Automation & Test in Europe Conference & Exhibition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DATE.2007.364395","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrated in a single device to the point that almost everything seems possible. In reality the difference between a successful design and a failure resides today more then ever in the ability of the design team to properly master all the critical design factors at once. In essence, today's system on chip design represent a multidiscipline challenge that spans from architecture through design to test and finally mass production. SoC design for portable applications has to cope with very unique constraints that normally greatly challenge the ability of an organization and most of the times of an entire company to fully master its industrialization capabilities and pushes concurrent design to new limits. In the end, only a well thought out Architecture followed by best practices design techniques with a high level of understanding of the manufacturing constraints and excellent logistics can result in a device that can be produced in the volume required by the cell phone industry today. This paper will try to capture how these challenges have been addressed to design the family of Application Processing Engines named Nomadiktrade. The paper will specifically focus on the third generation device labeled STn8815S22 where the integration capabilities of silicon technology have been pared with those of System in Package design to provide and extremely compact and effective System on Chip for portable multimedia applications. An overview of the main success factors and challenges will be presented driving the reader from the Architecture conception through the chip industrialization. Both silicon design and packaging design will be illustrated, highlighting those techniques that made this incredible product a reality
便携式多媒体SoC设计:一个全球性的挑战
每个新技术节点带来的内在能力为广泛的系统集成选项开辟了道路,并不断使新的应用程序集成到单个设备中,以至于几乎一切都是可能的。在现实中,一个成功的设计和一个失败的设计之间的区别比以往任何时候都更多地取决于设计团队一次正确掌握所有关键设计因素的能力。从本质上讲,今天的片上系统设计代表了一个多学科的挑战,从架构到设计,再到测试,最后到量产。便携式应用的SoC设计必须应对非常独特的限制,这些限制通常极大地挑战了组织和整个公司完全掌握其工业化能力的能力,并将并发设计推向了新的极限。最后,只有经过深思熟虑的架构,以及对制造限制的高度理解和优秀的物流的最佳实践设计技术,才能产生当今手机行业所需的批量生产的设备。本文将尝试捕捉如何解决这些挑战来设计名为Nomadiktrade的应用程序处理引擎家族。本文将特别关注标记为STn8815S22的第三代器件,其中硅技术的集成能力与系统封装设计的集成能力相比较,为便携式多媒体应用提供了极其紧凑和有效的片上系统。将概述主要的成功因素和挑战,推动读者从架构概念到芯片工业化。无论是硅设计和包装设计将说明,突出那些技术,使这一令人难以置信的产品成为现实
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