Contrasts in Physical Design between LSI and VLSI

W. Heller
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引用次数: 1

Abstract

In the last five years, there has been rapid growth in logic and memory chip circuit density. The number of different digital processors and the typical size of such processors has also grown. With all this growth, alternatives in VLSI design style as well as packaging have to be considered. These consist, on the one hand, of powerful automated placement and wiring routines, indispensable on large regular package images, and, on the other, of techniques facilitating rapid, interactive adaptation of functional logic design to the layout and interconnection of "macros" on large chips. Some results from study of each method are presented.
大规模集成电路和超大规模集成电路物理设计的对比
在过去的五年中,逻辑和存储芯片的电路密度有了快速的增长。不同数字处理器的数量和这种处理器的典型尺寸也在增长。随着所有这些增长,必须考虑超大规模集成电路设计风格和封装的替代方案。一方面,这些包括强大的自动放置和布线程序,这在大型常规封装图像中是必不可少的;另一方面,这些技术促进了功能逻辑设计的快速、交互式适应,以适应大型芯片上“宏”的布局和互连。给出了各种方法的一些研究结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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