HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS

Abstract

Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.