A high frequency, high power miniature DC to DC power supply utilizing MCM-L technology

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI:10.1109/MCMC.1996.510771

G. Miller, M. Salatino

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引用次数: 1

Abstract

Harris Semiconductor participates in the Intelligent Power (IP) market, delivering various products used in industrial and commercial power supplies and power control systems. Intelligent Power refers to the integration of analog, logic, and high power handling circuits into a single chip. Harris Semiconductor's expertise in this arena has produced products which can deliver voltages up to 100 VDC and currents in excess of 10 amperes with switching speeds under 3 nanoseconds. Switching high currents this quickly can cause damaging voltage spikes when encapsulated in plastic packages. Much of our IP customer base is concerned with power supply size and efficiency. The subtleties of developing a power supply that transcends these issues can derail even the best die and package design efforts. To assist in our customers' system-level solutions, Harris is combining our Intelligent Power devices with other normally discrete components into a low cost, high performance laminate Multi-Chip Module (MCM-L) embodiment of a major power supply building block. This paper describes Harris' effort from the problem statement to the comparative physical and performance results of the solution.

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采用MCM-L技术的高频、大功率微型直流到直流电源

Harris Semiconductor参与智能电源(IP)市场，提供各种用于工业和商业电源和电源控制系统的产品。智能电源是指将模拟、逻辑和高功率处理电路集成到单个芯片中。哈里斯半导体在这一领域的专业知识生产的产品可以提供高达100 VDC的电压和超过10安培的电流，开关速度低于3纳秒。当封装在塑料包装中时，如此快速地切换大电流会导致破坏性的电压尖峰。我们的许多IP客户群都关注电源的大小和效率。开发超越这些问题的电源的微妙之处可能会使最好的模具和封装设计工作脱轨。为了协助客户的系统级解决方案，哈里斯将我们的智能电源器件与其他通常分立的组件结合成一个低成本，高性能的层压板多芯片模块(MCM-L)，体现了主要的电源模块。本文描述了Harris从问题陈述到解决方案的比较物理和性能结果的努力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)

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