Electronic package thermal response prediction to power surge

Abstract

A predictive technique combining the thermal/electrical RC analogy and linear superposition is presented, which estimates the package's thermal response to power surge based on its thermal transient step response. The solution so developed was compared with finite element analysis (FEA) results, and the match is reasonably good. The technique presented in this paper can be extended to different packages, modules, etc. and for various thermal stimuli so long as the principles of the RC analogy and superposition scheme hold.