A simulation system for capacitance variation by CMP process including defocus effect

T. Ohta, M. Fujinaga, M. Kimura, T. Wada, K. Nishi
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Abstract

We have developed a total interconnect simulation system including a CMP model. The capacitance variation due to pattern width difference from focus effects on a globally nonuniform surface by CMP is simulated with this system. The paper also shows a way to reduce the capacitance variation due to CMP processes derived from these simulations.
一个包含散焦效应的CMP过程电容变化的仿真系统
我们开发了一个包括CMP模型在内的全互连仿真系统。利用该系统模拟了CMP在全局非均匀表面上焦点效应引起的图案宽度差引起的电容变化。本文还展示了一种方法,以减少由这些模拟得出的CMP过程引起的电容变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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