Davis Hemenway, A. Nicholson, K. Barth, W. Sampath
{"title":"Using computational simulation to model CdS/CdTe processing in close-space sublimation","authors":"Davis Hemenway, A. Nicholson, K. Barth, W. Sampath","doi":"10.1109/PVSC.2015.7355792","DOIUrl":null,"url":null,"abstract":"Sublimation based processing has proven to be an efficient method for manufacturing thin film CdS/CdTe PV devices. Recent advancements in computational simulation have opened a door for comprehensive modeling and analysis of the many processes involved in creating a fully functional solar cell. Computational models have been developed for CdS, CdTe, CdCl2, and CuCl that include fluid mechanics, heat transfer, and chemical reactions. This modeling will allow manufacturers to evaluate source geometries, process temperatures, operating pressures, and film properties before committing money to developing hardware.","PeriodicalId":427842,"journal":{"name":"2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)","volume":"551 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2015.7355792","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Sublimation based processing has proven to be an efficient method for manufacturing thin film CdS/CdTe PV devices. Recent advancements in computational simulation have opened a door for comprehensive modeling and analysis of the many processes involved in creating a fully functional solar cell. Computational models have been developed for CdS, CdTe, CdCl2, and CuCl that include fluid mechanics, heat transfer, and chemical reactions. This modeling will allow manufacturers to evaluate source geometries, process temperatures, operating pressures, and film properties before committing money to developing hardware.