Role of interface and bulk defect-states in the low-voltage leakage conduction of ultrathin oxides

D. Ielmini, A. Spinelli, A. Lacaita, G. Ghidini
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引用次数: 4

Abstract

Experimental results on the leakage effects in ultrathin oxides ( nm) reveal that electron-hole recombination dominates the conduction process, at least at low voltages. The dependences of leakage and interface states on stress dose, stress polarity and time after stress are analyzed, providing evidence for the dominant role of bulk defect states in the leakage mechanism. Simulations with a recombinationand trapassisted tunneling model are finally shown, in support of the interpretation based on bulk defects.
界面和本体缺陷态在超薄氧化物低压漏导中的作用
在超薄氧化物(nm)中泄漏效应的实验结果表明,至少在低电压下,电子-空穴复合主导了传导过程。分析了泄漏和界面状态对应力剂量、应力极性和应力后时间的依赖关系,证明了体缺陷状态在泄漏机制中起主导作用。最后给出了重组和陷阱辅助隧道模型的模拟,以支持基于体缺陷的解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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