On the distribution of the FET threshold voltage shifts due to individual charged gate oxide defects

B. Kaczer, S. Amoroso, R. Hussin, A. Asenov, J. Franco, P. Weckx, P. Roussel, G. Rzepa, T. Grasser, N. Horiguchi
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引用次数: 8

Abstract

The factors contributing to the FET threshold voltage shift Δνth caused by charging of an individual trap, such as during Random Telegraph Noise (RTN), are discussed by analyzing device-calibrated simulation data. The Δνth distribution is observed to be a convolution of i) the position of the trap along the channel, randomized by ii) the random dopant distribution (RDD) responsible for percolative transport in the FET channel. In our TCAD simulation data the RDD component is observed to be roughly log-normally distributed. “Meta-simulations” varying this log-normal component are able to qualitatively reproduce a range of observed Δνth distribution shapes. In longer devices and/or in devices with high channel doping (or otherwise highly randomized channel potentials), the Δνth distribution tends toward log-normal. In the other, more relevant cases, the exponential Δνth distribution appears to be an acceptable approximation.
个别带电栅极氧化物缺陷引起的场效应晶体管阈值电压漂移分布
通过分析器件校准的仿真数据,讨论了在随机电报噪声(RTN)期间,单个陷阱充电导致场效应管阈值电压漂移Δνth的因素。观察到Δνth分布是i)陷阱沿通道的位置的卷积,随机化ii)负责FET通道中渗透传输的随机掺杂剂分布(RDD)。在我们的TCAD模拟数据中,观察到RDD组件大致为对数正态分布。“元模拟”改变这种对数正态成分能够定性地再现观察到的Δνth分布形状的范围。在较长的器件和/或具有高通道掺杂(或其他高度随机化的通道电位)的器件中,Δνth分布趋向于对数正态。在其他更相关的情况下,指数Δνth分布似乎是一种可接受的近似。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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