Packaging and reliability research on automobiles micro-pressure sensor

Abstract

A new type pressure sensor based on MEMS technology and the full oil cavity structure is developed in this paper, and the reliability of packaging process for sensor is researched, and its characteristics are measured. The experimental results demonstrate that the packaging materials and packaging process have all effect on reliability of the pressure sensor. By to coat a passivating layer on the chip can prevent effectively influence from the electric ions in silicone oil and improve obviously temperature stability of the pressure sensor. The using soft glue in die bonding process can diminish the sensor's zero point drift. The sensors resist fatigue characteristic and long reliability get be well resolved by bonding two golden wires. The systemic and all-around designing structure, reasonable selecting packaging material and optimize fabricating process can develop high quality the pressure sensor to meet requirements of the automobile environment.