Design for Manufacturing? Design for Yield!!!

M. Levitt
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引用次数: 2

Abstract

Today’s nanometer-scale designs are two orders-of-magnitude more complex than designs were in the early 1990s and are commonly manufactured with processes at or below the 130nm feature size. This has brought about a fundamental change in the way design teams must approach the release for their design data to their manufacturing partners. In the past, once a design was taped out and proven to be functional, the responsibility for ramping yield and enhancing the profitability of a design was primarily the responsibility of the manufacturing partner. This is no longer possible at 130nm and below. Once a manufacturing process has stabilized, direct action must be taken by each and every design team to “tune” their design for yield. Design-specific yield enhancement is the new frontier in EDA and while it includes the traditional Design for Manufacturing (DFM) technologies, it also covers much more. Failure to consider yield-degrading effects in IR drop, signal integrity, electro migration, and process variation will result is severe downstream problems in timing closure, functional errors during system bring-up, and the inability to achieve silicon yield and quality targets. In this talk Marc Levitt will discuss what is needed in a new generation design-for-yield tool suite to address the quality of silicon at its source.
为制造而设计?为产量而设计!!
今天的纳米级设计比20世纪90年代早期的设计复杂了两个数量级,通常采用130纳米或更低特征尺寸的工艺制造。这带来了设计团队必须向其制造合作伙伴发布设计数据的方式的根本变化。在过去,一旦设计完成并被证明是功能性的,提高产量和提高设计盈利能力的责任主要是制造合作伙伴的责任。在130nm及以下的情况下,这是不可能的。一旦制造过程稳定下来,每个设计团队都必须采取直接行动来“调整”他们的设计以达到良率。特定于设计的良率提高是EDA的新前沿,虽然它包括传统的制造设计(DFM)技术,但它还涵盖了更多内容。如果不考虑红外下降、信号完整性、电迁移和工艺变化等产率退化效应,将导致严重的下游问题,如定时关闭、系统启动时的功能错误以及无法实现硅产率和质量目标。在这次演讲中,Marc Levitt将讨论新一代的产量设计工具套件需要什么,以解决硅的源头质量问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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