A Submodule Test Method for Modular Multilevel Converter Based on Hardware-in-the-Loop System

Abstract

The test method for sub-circuits in modular topology has been widely studied in recent years. Most of the existing methods need to build extra hardware circuit and are not flexible. To improve the flexibility, this paper proposes a control and power hardware-in-the-loop test bench, which is capable of power and control signals interaction simultaneously. It could provide a real operating environment for sub-circuits under test, which is as like working together with the other parts of whole modular topology.