Adhesion-type micro end effector for micromanipulation

F. Arai, T. Fukuda
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引用次数: 36

Abstract

Micro manipulation is required for assembly and maintenance of micro machines and their parts. In this paper, we propose a new pick up and release method for micromanipulation. The proposed method utilizes pressure change based on temperature change inside the micro holes made on the end-effector surface. In order to pick up the micro object, the end-effector temperature is increased to exceed room temperature before touching the object. After contact with the object, its temperature is decreased and negative pressure is generated inside the micro holes to pick it up. To release it, the end-effector temperature is increased again. This method realizes quick response due to its scale advantage as long as it is miniaturized in micro order. We made a prototype end-effector by Si surface micromachining. We analyzed the static performance of this end-effector and conducted experiments. Finally, effectiveness of the proposed method is shown.
用于显微操作的黏附型微型末端执行器
微型机械及其部件的装配和维护需要微操作。在本文中,我们提出了一种新的微操作拾取和释放方法。该方法利用末端执行器表面微孔内部温度变化带来的压力变化。为了拾取微小物体,在接触物体之前,将末端执行器的温度提高到超过室温。与物体接触后,物体温度降低,微孔内产生负压将物体吸起。为了释放它,末端执行器的温度再次升高。由于该方法具有规模优势,只要在微观尺度上进行微型化,即可实现快速响应。采用硅表面微加工技术制作了一个末端执行器原型。我们分析了该末端执行器的静态性能并进行了实验。最后,验证了该方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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