Evaluation of stress distribution in direct stamping of silver nano ink by analysis of finite-element model

Abstract

Mechanical analysis in direct stamping of silver nano ink is simulated by a finite element model, Ansys. Stress distribution on the layer of silver nano ink is predicted while external pressure is applied onto the stamp. Compressive stress over the layer of silver nano ink is approximately the external pressure while higher stress is found at the both side-end of pattern trench. This compressive stress may help to compact silver nano ink in the trench of the stamp to form densified conductive electrode.