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Unique new packaging of semiconductor packaging technology high performation by encapsulation epoxy resin and VPES (vacuum printing encapsulation systems)

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298733
A. Okuno
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独特的新型封装半导体封装技术，采用高性能的封装环氧树脂和VPES(真空印刷封装系统)
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.
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