Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging

Abstract

In this paper, ultra-thin die handling process and stress-less dicing are presented in the trend of light, thin, short and small semiconductor packages. As always there are pros and cons, the advanced component should be dealt with disadvantage of manufacturing and handling issue. Singluation of 20µm silicon die handling with glass carrier using stress-less dicing has been researched and laser modification chemical etching(LMCE) has been performed as a stress-less dicing solution. It is demonstrated that kerf width is able to be controlled by the number of laser modification scan from 30µm to 100µm. In addition, chemical and physical damage is not observed in the layer of adhesion and silicon thin die although glass carrier is etched away. The dicing represents superior and clear sawing line definition with minimum edge chipping. Consequently, laser modification chemical etching is considered as a stress-less dicing solution for ultra-thin die-level handling in 2.5D and 3D integrated circuit packaging.