Resistive switching behavior of graphene oxide films in symmetric metal-insulator-metal structures

R. Rodríguez-Lamas, E. Masvidal-Codina, G. Pedreira, Adrián Sáez, G. Rius
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引用次数: 2

Abstract

In this work, the complete technological process for the fabrication of Ti/graphene oxide (GO)/Ti structures is discussed. A microelectronics-compatible deposition technique for GO films is developed, which enables fully covered samples. Control over GO thickness is obtained by a multiple-step spin coating process. GO films have been interfaced for preliminary electrical testing. First insights into the resistive switching properties of Ti/GO/Ti structures and limitations are also presented. Further investigation is needed to determine the potential of GO in the field of flexible non-volatile memories, where optimization of GO films is required.
对称金属-绝缘体-金属结构中氧化石墨烯薄膜的电阻开关行为
本文讨论了制备钛/氧化石墨烯(GO)/钛结构的完整工艺过程。开发了一种用于氧化石墨烯薄膜的微电子兼容沉积技术,该技术可以完全覆盖样品。对氧化石墨烯厚度的控制是通过多步旋转涂层工艺获得的。氧化石墨烯薄膜已经进行了初步的电气测试。本文还介绍了Ti/GO/Ti结构的电阻开关特性及其局限性。需要进一步的研究来确定氧化石墨烯在柔性非易失性存储器领域的潜力,其中需要优化氧化石墨烯薄膜。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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