Dynamic voltage assignment for thermal-constrained task scheduler on 3D multi-core processors

Chien-Hui Liao, Yu-Ze Lin, Charles H.-P. Wen
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引用次数: 2

Abstract

Thermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.
三维多核处理器上热约束任务调度程序的动态电压分配
三维多核处理器(3D- mcps)吞吐量优化的热约束任务调度程序已经得到了广泛的研究。大多数任务调度器关注热感知任务分配,以减少热点,从而在热约束下最大化吞吐量。与以往的工作不同,这项工作的重点是热感知任务分配,而不是电压分配。本文提出了动态电压分配方法,为减少3d - mcp的温度升高,可以先发制人地频繁地为核心分配不同的电压水平。实验结果表明,集成了动态电压分配方法的前两种任务调度程序,热点发生率分别降低了62.31%和59.09%,吞吐量分别提高了18.28%和18.35%。因此,与所提出的动态电压分配集成的任务调度程序可以更有效地减少热点的发生,并优化热约束下的3d - mcp的吞吐量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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