SOI material: ready to take over mainstream bulk Si

W. Maszara
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引用次数: 1

Abstract

An extensive effort has been undertaken to benchmark the quality of the 200 mm SOI substrates, involving all viable sources of the material in the world. A comprehensive overview of the state of the art of all pertinent parameters of this material is given. The quality of the recent material appears very competitive with the bulk material. In particular, the level of defects in the SOI film is comparable to bulk, below 0.1/cm/sup 2/ for the best material. SOI wafer processing will require only minor equipment and process adjustments. The main challenges for the SOI material today is a sustainable consistency of its parameters, the price and volume availability.
SOI材料:准备接管主流块状硅
已经进行了广泛的努力,对200毫米SOI基板的质量进行基准测试,涉及世界上所有可行的材料来源。全面概述了该材料的所有相关参数的最新技术。新材料的质量与散装材料相比很有竞争力。特别是,SOI薄膜中的缺陷水平与体积相当,低于0.1/cm/sup 2/为最佳材料。SOI晶圆加工只需要轻微的设备和工艺调整。目前SOI材料面临的主要挑战是其参数、价格和数量的可持续一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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