{"title":"SOI material: ready to take over mainstream bulk Si","authors":"W. Maszara","doi":"10.1109/ICSICT.1998.786074","DOIUrl":null,"url":null,"abstract":"An extensive effort has been undertaken to benchmark the quality of the 200 mm SOI substrates, involving all viable sources of the material in the world. A comprehensive overview of the state of the art of all pertinent parameters of this material is given. The quality of the recent material appears very competitive with the bulk material. In particular, the level of defects in the SOI film is comparable to bulk, below 0.1/cm/sup 2/ for the best material. SOI wafer processing will require only minor equipment and process adjustments. The main challenges for the SOI material today is a sustainable consistency of its parameters, the price and volume availability.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"147 9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.786074","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
An extensive effort has been undertaken to benchmark the quality of the 200 mm SOI substrates, involving all viable sources of the material in the world. A comprehensive overview of the state of the art of all pertinent parameters of this material is given. The quality of the recent material appears very competitive with the bulk material. In particular, the level of defects in the SOI film is comparable to bulk, below 0.1/cm/sup 2/ for the best material. SOI wafer processing will require only minor equipment and process adjustments. The main challenges for the SOI material today is a sustainable consistency of its parameters, the price and volume availability.