Realistic Fault Modeling for VLSI Testing

Wojciech Maly
{"title":"Realistic Fault Modeling for VLSI Testing","authors":"Wojciech Maly","doi":"10.1145/37888.37914","DOIUrl":null,"url":null,"abstract":"Functional failures of VLSI circuits are caused by process-induced defects. Such defects have very complex physical characteristics and may be significantly different from the simplistic defect models assumed by typical fault modeling techniques. In the tutorial an overview of the actual mechanisms causing processing defects, and the defects' electrical manifestations will be discussed. It will be demonstrated that inadequate insight into the physics of processing defects and the manufacturing process may lead to inefficient testing of actual VLSI circuits.","PeriodicalId":301552,"journal":{"name":"24th ACM/IEEE Design Automation Conference","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1987-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"268","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"24th ACM/IEEE Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/37888.37914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 268

Abstract

Functional failures of VLSI circuits are caused by process-induced defects. Such defects have very complex physical characteristics and may be significantly different from the simplistic defect models assumed by typical fault modeling techniques. In the tutorial an overview of the actual mechanisms causing processing defects, and the defects' electrical manifestations will be discussed. It will be demonstrated that inadequate insight into the physics of processing defects and the manufacturing process may lead to inefficient testing of actual VLSI circuits.
VLSI测试的现实故障建模
超大规模集成电路的功能失效是由工艺缺陷引起的。这些缺陷具有非常复杂的物理特征,可能与典型故障建模技术所假设的简单缺陷模型有很大不同。在本教程中概述了造成加工缺陷的实际机制,并将讨论缺陷的电气表现。它将证明,对加工缺陷和制造过程的物理认识不足可能导致实际VLSI电路的测试效率低下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信