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Stress impact of moisture diffusion measured with the stress chip

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1016/j.microrel.2014.02.022
F. Schindler-Saefkow, F. Rost, A. Otto, R. Pantou, R. Mrossko, B. Wunderle, B. Michel, S. Rzepka, J. Keller
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用应力片测量水分扩散的应力影响
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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