PVMaT technology improvements in the EFG high volume PV manufacturing line

Abstract

We report here on advances made in EFG technology over a 3-year PVMaT 5A2 NREL subcontract. We describe improvements to lower module costs through raising cell efficiencies to 14% and reduction of mechanical and electrical losses. Plasma etching of the laser-cut wafer edges has reduced acid use by >50%. We have introduced 10 cm /spl times/ 15 cm wafers into manufacturing, and a larger diameter EFG furnace for producing 12.5 /spl times/ 12.5 cm wafers has been designed and is in pilot testing. Module encapsulation materials and designs have been improved. This work has been accomplished while simultaneously ramping up to 20 MW in wafer production.