Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part I

Kirk A. Martin
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Abstract

This article, the first in a multi-part series, describes how to finely control remaining silicon thickness (RST) through the correction of mechanical surface profiles using multipoint thickness measurements. It explains why multipoint thickness measurements are necessary and discusses the realities of silicon thickness measurements. With careful processing, cleaning, and RST measurements, samples can be reliably processed to a 50 μm thickness with a variation of +/- 2.5 μm across the majority of the die.
对高度翘曲模具进行减薄和抛光以使其厚度接近一致的工艺:第1部分
本文是多部分系列文章中的第一篇,介绍了如何通过使用多点厚度测量校正机械表面轮廓来精细控制剩余硅厚度(RST)。解释了多点厚度测量的必要性,并讨论了硅厚度测量的实际情况。通过仔细的加工、清洁和RST测量,样品可以可靠地加工到50 μm的厚度,大部分模具的变化范围为+/- 2.5 μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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