Effect of electrodes material on the I-V-curve and switching of memristors on the base of electroformed open metal-SiO2-metal sandwich structure

S. Kudryavtsev, V. Mordvintsev, V. Naumov, E. S. Gorlachev
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Abstract

The study of electroforming processes in various open sandwich metal-SiO2-metal structures (with different materials of electrodes) and I–V-curves at both voltage polarities allowed to find the main factor responsible for the presence of stable electroforming and the absence of breakdowns after electroforming (N-shape I-V-curve can be drawn repeatedly). This factor is making of structure anode of tungsten at any (top or bottom) position of this electrode. The use of molybdenum instead of tungsten in such structures essentially allows to decrease the electroforming voltage (from 10-11 to 4-5 V), which makes the process more reliable.
基于电铸开放式金属- sio2 -金属夹层结构的电极材料对忆阻器i - v曲线和开关的影响
通过对各种开放式夹层金属- sio2 -金属结构(不同电极材料)的电铸过程和两种电压极性下的i - v曲线的研究,可以找到导致电铸稳定和电铸后无击穿的主要因素(n型i - v曲线可以反复绘制)。这个因素是在电极的任何位置(顶部或底部)制作钨阳极的结构。在这种结构中使用钼代替钨基本上可以降低电铸电压(从10-11到4-5 V),这使得工艺更可靠。
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