Silicon Compilation-A Hierarchical Use of PLAs

R. Ayres
{"title":"Silicon Compilation-A Hierarchical Use of PLAs","authors":"R. Ayres","doi":"10.1109/DAC.1979.1600126","DOIUrl":null,"url":null,"abstract":"This paper proposes a way to compile a silicon layout directly from synchronous logic specification. The motivation for introducing compilation into the silicon world comes from its extreme success in the software world. As we see silicon area increasing and circuit complexity increasing, we might feel much in common with the early day programmers who faced increasing memory availability along with increasing program complexity.\n Software and hardware revolve around the same basic concern: The software designer lays out a one dimensional array of memory whereas the integrated circuit designer lays out a two dimensional area of silicon. In each case, various constraints must be satisfied in order to obtain a working product. In addition, both efforts involve lots of modification.","PeriodicalId":345241,"journal":{"name":"16th Design Automation Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1979-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"16th Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DAC.1979.1600126","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

This paper proposes a way to compile a silicon layout directly from synchronous logic specification. The motivation for introducing compilation into the silicon world comes from its extreme success in the software world. As we see silicon area increasing and circuit complexity increasing, we might feel much in common with the early day programmers who faced increasing memory availability along with increasing program complexity. Software and hardware revolve around the same basic concern: The software designer lays out a one dimensional array of memory whereas the integrated circuit designer lays out a two dimensional area of silicon. In each case, various constraints must be satisfied in order to obtain a working product. In addition, both efforts involve lots of modification.
硅编译- pla的层次化应用
本文提出了一种直接从同步逻辑规范中编译芯片版图的方法。将编译引入硅世界的动机来自于它在软件世界的巨大成功。当我们看到硅面积增加,电路复杂性增加时,我们可能会感到与早期面临内存可用性增加和程序复杂性增加的程序员有很多共同之处。软件和硬件都围绕着同样的基本问题:软件设计者设计一个一维的存储器阵列,而集成电路设计者设计一个二维的硅片区域。在每种情况下,为了获得工作产品,必须满足各种约束。此外,这两种努力都涉及大量的修改。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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