A 38 GHz inverse class-F power amplifier with 38.5% peak PAE, 16.5 dB gain, and 50 mW Psat in 0.13-µm SiGe BiCMOS

S. Y. Mortazavi, Kwang-Jin Koh
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引用次数: 16

Abstract

This paper presents a 38 GHz 2-stage harmonic-tuned power amplifier consisted of a class-F-1 output power amplifier proceeded by a class-AB driving stage in 0.13 μm SiGe BiCMOS technology. In order to shape highly efficient class-F-1 current and voltage waveforms, the PA adopts multi-resonance series and parallel load networks that modulate load impedance to generate an optimum 50-Ω for signal band, high impedance at the 2nd harmonic band and low impedance at the 3rd harmonic band. Inter-stage matching between the driver and output stage is also applied to deliver optimal power to the output stage with a maximum PAE, resulting in 38.5% of peak PAE with 50 mW Psat at 38 GHz, which is one of the highest PAEs in silicon technology at mm-wave. The chip size is 0.9×0.55 μm2 including all pads.
一个38 GHz反f类功率放大器,峰值PAE为38.5%,增益为16.5 dB, Psat为50 mW,采用0.13-µm SiGe BiCMOS
提出了一种采用0.13 μm SiGe BiCMOS技术,由f -1级输出功率放大器和ab级驱动级组成的38ghz两级谐波调谐功率放大器。为了形成高效的f -1类电流和电压波形,PA采用多谐振串联和并联负载网络,通过对负载阻抗进行调制,使信号频带达到最佳50-Ω,二次谐波频带阻抗高,三次谐波频带阻抗低。驱动器和输出级之间的级间匹配也被应用于以最大PAE为输出级提供最佳功率,在38 GHz时产生50 mW Psat的峰值PAE为38.5%,这是硅技术中毫米波的最高PAE之一。芯片尺寸为0.9×0.55 μm2,包括所有衬垫。
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