Bin Zhang, Rong Su, S. Feng, Guangchen Zhang, Chunsheng Guo, Yin Liu, Kaikai Ding
{"title":"Thermal analysis of ICS based on equivalent thermal resistance and skill language","authors":"Bin Zhang, Rong Su, S. Feng, Guangchen Zhang, Chunsheng Guo, Yin Liu, Kaikai Ding","doi":"10.1109/IPFA.2009.5232590","DOIUrl":null,"url":null,"abstract":"The thermal analysis of ICs has been studied in different methods for years. In this paper, a new method to analyze the steady-state temperature distribution of integrated circuit is presented. According to equivalent thermal resistance formula obtaining by an aid tool ANSYS and programming idea, the temperature distribution graph of an analog integrated circuit is obtained. And the result is verified by a complete ANSYS analysis.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232590","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The thermal analysis of ICs has been studied in different methods for years. In this paper, a new method to analyze the steady-state temperature distribution of integrated circuit is presented. According to equivalent thermal resistance formula obtaining by an aid tool ANSYS and programming idea, the temperature distribution graph of an analog integrated circuit is obtained. And the result is verified by a complete ANSYS analysis.