Semi-analytical techniques for substrate characterization in the design of mixed-signal ICs

E. Charbon, R. Gharpurey, A. Sangiovanni-Vincentelli, R. Meyer
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引用次数: 16

Abstract

A number of methods are presented for highly efficient calculation of substrate current transport. A three-dimensional Green's Function based substrate representation, in combination with the use of the Fast Fourier Transform, significantly speeds up the computation of sensitivities with respect to all parameters associated with a given architecture. Substrate sensitivity analysis is used in a number of physical optimization tools, such as placement and trend analysis for the estimation of the impact of technology migration and/or layout re-design.
混合信号集成电路设计中衬底表征的半分析技术
本文提出了几种高效计算衬底电流输运的方法。基于三维格林函数的基片表示,结合快速傅里叶变换的使用,显著加快了与给定结构相关的所有参数的灵敏度计算。基板敏感性分析用于许多物理优化工具,例如用于估计技术迁移和/或布局重新设计影响的放置和趋势分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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