Predictive process control for change in chemical dry etching equipment condition

Miyuki Maruta, Y. Oomuro, Kazutaka Nagashima
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引用次数: 1

Abstract

In semiconductor production, a compound abnormal factor is undetectable in independent QC (Quality Control) and equipment log management. It is a problem to influence the low yield of semiconductor manufacturing. The predictive model was created by the relation of processing form and some parameters. The motif is CDE (Chemical Dry Etching) equipment. Equipment control using predictive model was considered. Management system was established by monitoring the difference of predicted value and actual value.
化学干蚀刻设备状态变化的预测过程控制
在半导体生产中,在独立的QC(质量控制)和设备日志管理中无法检测到复合异常因素。这是影响半导体制造低良率的一个问题。根据加工形式与部分参数的关系建立预测模型。主题是CDE(化学干蚀刻)设备。采用预测模型对设备进行控制。通过监测预测值与实测值的差异,建立了管理体系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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