NBTI Degradation: A Problem or a Scare?

K. Saluja, Shriram Vijayakumar, Warin Sootkaneung, Xaingning Yang
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引用次数: 35

Abstract

Negative bias temperature instability (NBTI) has been identified as a major and critical reliability issue for PMOS devices in nano-scale designs. It manifests as a negative threshold voltage shift, thereby degrading the performance of the PMOS devices over the lifetime of a circuit. In order to determine the quantitative impact of this phenomenon an accurate and tractable model is needed. In this paper we explore a novel and practical methodology for modeling NBTI degradation at the logic level for digital circuits. Its major contributions include i) a SPICE level simulation to identify stress on PMOS devices under varying input conditions for various gate types and ii) a gate level simulation methodology that is scalable and accurate for determining stress on large circuits. We validate the proposed logic level simulation methodology by showing that it is accurate within 1% of the reference model. Contrary to many other papers in this area, our experimental results show that the overall delay degradation of large digital circuits due to NBTI is relatively small.
NBTI退化:问题还是恐惧?
负偏置温度不稳定性(NBTI)已被确定为PMOS器件在纳米级设计中主要和关键的可靠性问题。它表现为负阈值电压移位,从而降低了PMOS器件在电路寿命期间的性能。为了确定这一现象的定量影响,需要一个准确和易于处理的模型。在本文中,我们探索了一种新颖实用的方法来模拟数字电路的逻辑级NBTI退化。其主要贡献包括i) SPICE级仿真,用于识别各种栅极类型的PMOS器件在不同输入条件下的应力;ii)栅极级仿真方法,可扩展且准确地确定大型电路的应力。我们通过表明它在参考模型的1%以内的精度来验证所提出的逻辑级仿真方法。与该领域的许多其他论文相反,我们的实验结果表明,由于NBTI导致的大型数字电路的总体延迟退化相对较小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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