{"title":"ESD source modeling in FDTD","authors":"Mubashir Rizvi, J. L. Vetri","doi":"10.1109/ISEMC.1994.385680","DOIUrl":null,"url":null,"abstract":"Numerical modeling of the ESD event using the finite difference time domain (FDTD) technique is considered. Two methods of modeling an electrostatic discharge using FDTD are compared. The first consists of introducing the fields into the mesh from known analytic results in a region of the mesh which is homogeneous and letting the fields propagate towards the interaction of interest. The second consists of modeling the discharge current directly by discretizing the current density term in the Maxwell equations. The second offers obvious advantages in that the discharge can be modeled close to inhomogeneities such as circuit board traces and chip leads.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385680","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
Numerical modeling of the ESD event using the finite difference time domain (FDTD) technique is considered. Two methods of modeling an electrostatic discharge using FDTD are compared. The first consists of introducing the fields into the mesh from known analytic results in a region of the mesh which is homogeneous and letting the fields propagate towards the interaction of interest. The second consists of modeling the discharge current directly by discretizing the current density term in the Maxwell equations. The second offers obvious advantages in that the discharge can be modeled close to inhomogeneities such as circuit board traces and chip leads.<>