Meeting with the Forthcoming IC Design -- The Era of Power, Variability and NRE Explosion and a Bit of the Future --

T. Sakurai
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引用次数: 2

Abstract

In the foreseeable future, VLSI design will meet a couple of explosions: power, variability and NRE (non-recurring engineering cost). Some of the solutions for power-aware designs are covered in this talk with relation to variability. A remedy for the NRE explosion is to reduce the number of developments and manufacture and sell tens of millions of chips under a fixed design. System-in-a-Package approach may embody such possibility. Several new technologies are described to enable 3-dimensional stacking of chips to build high-performance yet lowpower electronics systems. On the other extreme of the silicon VLSI's which stay as small as a centimeter square, a new domain of electronics called large-area integrated circuit as large as meters is waiting, which may open up a new continent of applications in the era of ubiquitous electronics. One of the implementations of the large-area electronics is based on organic transistors. The talk will provide perspectives of the organic circuit design taking E-skin, sheet-type scanner and Braille display as examples.
与即将到来的IC设计会面-功率,可变性和NRE爆炸的时代以及未来的一点-
在可预见的未来,VLSI设计将遇到几个爆炸:功率,可变性和NRE(非经常性工程成本)。本演讲涉及到与可变性相关的一些功率感知设计的解决方案。解决NRE爆炸的方法是减少开发数量,按照固定的设计制造并销售数千万个芯片。系统包方法可能体现这种可能性。介绍了几种新技术,使芯片的三维堆叠能够构建高性能但低功耗的电子系统。在硅VLSI的另一个极端,保持在一厘米见方,一个新的电子领域,称为大面积集成电路,大到米,这可能会在无处不在的电子时代开辟一个新的应用大陆。大面积电子学的实现之一是基于有机晶体管。讲座将以电子皮肤、片状扫描仪和盲文显示为例,从有机电路设计的角度进行阐述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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