The new equipment for IC testing

Abstract

The very large scale integration used for the design and fabrication of modern microelectronics devices should have good suitability for temperature. For example the space grade IC should withstand hard temperature shock from +125/spl deg/C to -55/spl deg/C or reverse in 5 mins. For failure analysis techniques, it is necessary to investigate the performance of an IC under different temperatures. Therefore the demand for new test equipment arises, which can cool or heat ICs to make the die temperature of the IC change from high to low or from low to high. There are some mechanical refrigeration systems that you can choose, but it is difficult to control the temperature of the IC, and this kind of apparatus often has problems in the summer. We have developed a new equipment with working temperatures in the range of -55/spl deg/C/spl sim/+125/spl deg/C, it uses a thermoelectric cooler as cooling or heating units. We can easily control the cold plate temperature by means of regulating the input voltage. In this equipment, the cold side can be smoothly regulated, stabilized and indicated on the display. This paper introduces the design of the control system and multistage TEM cooling system, the cooling power of which is 3 W, when the temperature of cold side is -55/spl deg/C and hot side is 30/spl deg/C.