Modelling of Resistive and Geometrical Discontinuities in Microstrip Interconnections on Integrated Circuits

S. Sali
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引用次数: 13

Abstract

An algorithm suitable for the computer aided analysis of geometrical and resistive discontinuities present in microstrip interconnections on silicon integrated circuit subtrates is presented. The distortion and dispersion of an electrical pulse caused by such discontinuities as it propagates along the microstrip interconnect is investigated in detail. Studies carried out to assess the advantages of using superconducting tracks for the interconnections in integrated circuits in the presence of modal dispersion and geometry dependent discontinuities are also presented. The numerical results are demonstrated on realistic microstrip models for the interconnects with common type discontinuities which are selected from a practical VLSI prototype.
集成电路微带互连中电阻性和几何不连续的建模
提出了一种适用于硅集成电路衬底上微带互连中几何和电阻不连续现象的计算机辅助分析算法。详细研究了电脉冲沿微带互连线传播时由这种不连续性引起的畸变和色散。本文还介绍了在存在模态色散和几何相关不连续的情况下,利用超导轨道进行集成电路互连的优点。数值结果在实际VLSI样机中选取的具有共型不连续点的微带互连模型上进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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