{"title":"A scalable non-electroformed memdiode for neuromorphic circuitry","authors":"J. Shank, M. Tellekamp, W. Doolittle","doi":"10.1109/DRC.2016.7548463","DOIUrl":null,"url":null,"abstract":"An electronic device is introduced that exhibits rectification, hysteresis, and capacitance. These three properties replicate biological functionality useful in neuromorphic circuitry. A similar device operating on different physical mechanisms was previously demonstrated in 2013, but its fabrication required an electro-formation process that introduces difficulties scaling to high density circuitry [1]. The metal-insulator-metal (MIM) structures discussed herein exhibit rectification, hysteresis, and capacitance resulting from an intentionally high defect density as deposited with no post-fabrication treatment necessary.","PeriodicalId":310524,"journal":{"name":"2016 74th Annual Device Research Conference (DRC)","volume":"2005 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 74th Annual Device Research Conference (DRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.2016.7548463","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
An electronic device is introduced that exhibits rectification, hysteresis, and capacitance. These three properties replicate biological functionality useful in neuromorphic circuitry. A similar device operating on different physical mechanisms was previously demonstrated in 2013, but its fabrication required an electro-formation process that introduces difficulties scaling to high density circuitry [1]. The metal-insulator-metal (MIM) structures discussed herein exhibit rectification, hysteresis, and capacitance resulting from an intentionally high defect density as deposited with no post-fabrication treatment necessary.