Inverse circuit simulation based low-frequency noise extraction in SiGe HBTs

G. Niu, Jin Tang, Zhiming Feng, D. Sheridani, D.L. Haramel
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引用次数: 3

Abstract

Transistor low-frequency noise is an important issue in both base hand and RF circuits of a wireless transceiver [I]. In a bipolar transistor, the major low-frequency noise source lies in the base current. Experimentally, it bas been established that this hase current noise source is located between the internal base and emitter nodes in an equivalent circuit [I]. This base current low-frequency noise, denoted as ibn. is often measured indirectly from the collector voltage noise by presenting to the transistor base a Source impedance much greater than the input impedance, as shown in Fig. 1. The measured collector voltage noise is converted to collector current noise using SI, = SVc/Ri,e88' which is then converted to the base current noise using SI , = . Y ~ ~ / f l , $ with Bo, being the low-frequency small signal oc current gain. Bo, is often determined from Gummel characteristics measured under a biasing condition close to that used in the noise measurement. We note that the hase current noise can also be measured "dtrectly" from the base using a high precision current amplifier with an input impedance much lower than transistor input impedance. Each method has its advantages and disadvantages in practice, as discussed in [I] . In general, the indirect method is easier to implement, and widely used. We focus on the indirect method in this work. Similar limitations and assumptions exist in the "direct" measurement method as well. The widely used conventional measurement method, however, is based on a simplified equivalent circuit derived under isothermal condition. While in modem SiGe HBTs, self-heating can be significant, in part due to high operating current density. To enable high current density operation, the collector doping is increased with device scaling, which then increases collector-base junction field and thus avalanche multiplication. One can therefore expect errors in the low-frequency noise measured using the conventional method in high speed SiGe HBTs. The purpose of this work is to develop a new method -
基于逆电路仿真的SiGe HBTs低频噪声提取
晶体管低频噪声是无线收发器基手电路和射频电路中的一个重要问题[1]。在双极晶体管中,主要的低频噪声源在于基极电流。实验证明,该相电流噪声源位于等效电路内部基极和发射极节点之间[1]。该基电流低频噪声,记为ibn。通常通过向晶体管基极提供远大于输入阻抗的源阻抗来间接测量集电极电压噪声,如图1所示。将测量到的集电极电压噪声用SI = SVc/Ri,e88’转换为集电极电流噪声,然后用SI = SVc/Ri转换为基极电流噪声。Y ~ ~ / f 1, $,其中Bo为低频小信号电流增益。Bo通常由在接近噪声测量的偏置条件下测量的Gummel特性确定。我们注意到,使用输入阻抗远低于晶体管输入阻抗的高精度电流放大器,也可以从基极“直接”测量相电流噪声。每种方法在实践中都有其优点和缺点,如[1]所述。一般来说,间接法比较容易实现,应用比较广泛。在这项工作中,我们着重于间接方法。类似的限制和假设也存在于“直接”测量方法中。然而,广泛使用的传统测量方法是基于等温条件下推导的简化等效电路。而在现代SiGe hbt中,自热可能是显著的,部分原因是由于高工作电流密度。为了实现高电流密度操作,集电极掺杂随着器件的缩放而增加,从而增加集电极基极结场,从而增加雪崩倍增。因此,在高速SiGe hbt中使用传统方法测量低频噪声时,可以预期会出现误差。这项工作的目的是发展一种新的方法-
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