A Study of Stored Charge Interference and Fringing Field Effects in Sub-30nm Charge-Trapping NAND Flash

Y. Hsiao, H. Lue, K. Hsieh, Rich Liu, Chih-Yuan Lu
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引用次数: 8

Abstract

The interference and fringing field effects beyond sub-30 nm node charge-trapping(CT) NAND Flash are studied critically using 3D simulation. Due to the relatively large EOT (>15 nm) compared to the device dimension (F), the most severe interference comes from adjacent pass-gate WL bias disturb through the edge fringing field effect. On the other hand, the program charges in adjacent devices generate only minor interference effect (<200 mV) down to 25 nm node. Low-K spacer between WL's is very effective in suppressing the pass-gate interference due to the suppressed fringing field effect. For the first time we propose that low-K spacer can improve the short-channel effect as well as program/erase characteristics. The physical reason is that low-K spacer can confine the electrical field inside the channel thus improve the device performances. By suitably engineering the low-K spacer, p-well/junction and EOT we suggest that scaling of CT NAND Flash beyond 15 nm is quite feasible.
亚30nm电荷捕获NAND闪存中存储电荷干扰和条纹场效应的研究
利用三维仿真技术对亚30nm节点电荷捕获(CT) NAND闪存的干涉和边缘场效应进行了深入研究。由于与器件尺寸(F)相比EOT较大(>15 nm),因此最严重的干扰来自相邻通栅通过边缘边缘场效应产生的WL偏置干扰。另一方面,相邻器件中的程序电荷仅产生较小的干扰效应(<200 mV),直至25 nm节点。由于抑制了条纹场效应,低k间隔层可以有效地抑制通门干扰。我们首次提出低k间隔可以改善短通道效应和程序/擦除特性。物理原因是低k间隔可以限制通道内的电场,从而提高器件性能。通过适当地设计低k间隔层、p阱/结和EOT,我们认为将CT NAND闪存缩放到15 nm以上是完全可行的。
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