Y. Hsiao, H. Lue, K. Hsieh, Rich Liu, Chih-Yuan Lu
{"title":"A Study of Stored Charge Interference and Fringing Field Effects in Sub-30nm Charge-Trapping NAND Flash","authors":"Y. Hsiao, H. Lue, K. Hsieh, Rich Liu, Chih-Yuan Lu","doi":"10.1109/IMW.2009.5090576","DOIUrl":null,"url":null,"abstract":"The interference and fringing field effects beyond sub-30 nm node charge-trapping(CT) NAND Flash are studied critically using 3D simulation. Due to the relatively large EOT (>15 nm) compared to the device dimension (F), the most severe interference comes from adjacent pass-gate WL bias disturb through the edge fringing field effect. On the other hand, the program charges in adjacent devices generate only minor interference effect (<200 mV) down to 25 nm node. Low-K spacer between WL's is very effective in suppressing the pass-gate interference due to the suppressed fringing field effect. For the first time we propose that low-K spacer can improve the short-channel effect as well as program/erase characteristics. The physical reason is that low-K spacer can confine the electrical field inside the channel thus improve the device performances. By suitably engineering the low-K spacer, p-well/junction and EOT we suggest that scaling of CT NAND Flash beyond 15 nm is quite feasible.","PeriodicalId":113507,"journal":{"name":"2009 IEEE International Memory Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Memory Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMW.2009.5090576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
The interference and fringing field effects beyond sub-30 nm node charge-trapping(CT) NAND Flash are studied critically using 3D simulation. Due to the relatively large EOT (>15 nm) compared to the device dimension (F), the most severe interference comes from adjacent pass-gate WL bias disturb through the edge fringing field effect. On the other hand, the program charges in adjacent devices generate only minor interference effect (<200 mV) down to 25 nm node. Low-K spacer between WL's is very effective in suppressing the pass-gate interference due to the suppressed fringing field effect. For the first time we propose that low-K spacer can improve the short-channel effect as well as program/erase characteristics. The physical reason is that low-K spacer can confine the electrical field inside the channel thus improve the device performances. By suitably engineering the low-K spacer, p-well/junction and EOT we suggest that scaling of CT NAND Flash beyond 15 nm is quite feasible.