Shuxian Chen, Feng Lin, Bin Yang, Chunxu Li, Yu Huang
{"title":"A new study of backend process on 0.18um BCD NLDMOS on-state BV characteristics","authors":"Shuxian Chen, Feng Lin, Bin Yang, Chunxu Li, Yu Huang","doi":"10.1109/IPFA47161.2019.8984790","DOIUrl":null,"url":null,"abstract":"With the continuous expansion of power ICs in various industrial and consumer levels, the requirements for Laterally-Double-Diffused MOS(LDMOS) characteristics are getting more and more aggressive. BVon characteristics of LDMOS is rather critical for wide Safe Operation Area (SOA), requesting in higher-end fields such as automotive electronics. In this paper, based on the modular design of the 0.18μm Bipolar-CMOS-DMOS (BCD) medium and high voltage process platform, the process platform should not only consider the impact of the introduction of high-voltage process on CMOS, but also the impact of the special Back- End-Oxide-Layer(BEOL) process customized for embeds Non-Volatile Memory (E-NVM) on high-voltage devices. For the problem of insufficient on-state breakdown voltage (BVon) and poor on-chip uniformity of NLDMOS, we studied the influence mechanism about BEOL process on NLDMOS BVon characteristic.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984790","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
With the continuous expansion of power ICs in various industrial and consumer levels, the requirements for Laterally-Double-Diffused MOS(LDMOS) characteristics are getting more and more aggressive. BVon characteristics of LDMOS is rather critical for wide Safe Operation Area (SOA), requesting in higher-end fields such as automotive electronics. In this paper, based on the modular design of the 0.18μm Bipolar-CMOS-DMOS (BCD) medium and high voltage process platform, the process platform should not only consider the impact of the introduction of high-voltage process on CMOS, but also the impact of the special Back- End-Oxide-Layer(BEOL) process customized for embeds Non-Volatile Memory (E-NVM) on high-voltage devices. For the problem of insufficient on-state breakdown voltage (BVon) and poor on-chip uniformity of NLDMOS, we studied the influence mechanism about BEOL process on NLDMOS BVon characteristic.