A novel method of WTW for productivity improvement — Stephen Tseng

J. Kung, Y. Hsu, James Lin, C. W. Yang, N. S. Shen
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Abstract

In order to improve tool productivity in semi-conductor manufacturing, we come up with this work reporting a combination of Wait Time Waste (WTW) and Hidden Capacity Diagnostic (HCD) analysis methodology to extract the wafer process information from tool log via SEMI standard and SECS data to do visualization analysis. Thereafter, it is easier to find opportunity to reduce unnecessary process waste time and tool abnormality.
一种提高生产率的WTW新方法- Stephen Tseng
为了提高半导体制造中的工具生产率,我们提出了将等待时间浪费(WTW)和隐藏容量诊断(HCD)分析方法相结合的工作报告,通过SEMI标准和SECS数据从工具日志中提取晶圆过程信息并进行可视化分析。此后,更容易找到机会,以减少不必要的工艺浪费时间和刀具异常。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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