Evaluation of SU8 photo polymer for microwave packaging applications

Abstract

Epoxy based photo polymer - SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Waveguide transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on ST-Cut Quartz substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging are modeled using lumped components and the measured data are validated with simulations in Advanced Design System. The measured and simulated data agree favorably with each other, for both before and after packaging.