Growth of semi-polar (101̄3) AlN films on the silicon

Shih-Bin Jhong, Maw-Shung Lee, Sean Wu, Kuan-Ting Liu, Zhi-Xun Lin, Y. Lai, Ping-Feng Yang
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Abstract

Highly semi-polar (101̄3) oriented and fine structural AlN films were successfully prepared on silicon substrate by rf magnetron sputtering in this research. The dependence of the nitrogen concentrations and the material characteristics of the films (crystalline structure and micro morphology) were investigated. The crystalline structure of the films was determined by X-ray diffraction (XRD) and the surface microstructure of films was quantitatively investigated using an atomic force microscope (AFM). Different nitrogen concentrations (50%, 58%, 67% and 75%) were used to deposit the films. As decreasing the nitrogen concentrations, the XRD intensity of the semi-polar (101̄3) oriented increases, the crystallite size of the films increases and the roughness of top surface decreases. The experimental results demonstrate that the highly semi-polar (101̄3) oriented AlN films appeared at the lower nitrogen concentration.
硅表面生长半极性(101)AlN薄膜
本研究采用射频磁控溅射技术在硅衬底上成功制备了高度半极性(101’3)取向和精细结构的AlN薄膜。研究了氮浓度与薄膜材料特性(晶体结构和微观形貌)的关系。用x射线衍射仪(XRD)测定了膜的晶体结构,并用原子力显微镜(AFM)定量研究了膜的表面微观结构。采用不同的氮浓度(50%、58%、67%和75%)沉积薄膜。随着氮浓度的降低,半极性(101∶3)取向的XRD强度增大,膜的晶粒尺寸增大,顶表面粗糙度减小。实验结果表明,在较低的氮浓度下,出现了高度半极性(101’3)取向的AlN膜。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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