Optimized cell structure for FinFET array Flash memory

E. Cho, T.Y. Kim, C.H. Lee, C. Lee, J. Yoon, H. Cho, H. Kang, Y. Ahn, Donggun Park, Kinam Kim
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引用次数: 4

Abstract

In this paper, a highly manufacturable 256 M body tied tri-gate fin array NOR-type Flash memory, with 70 nm fin width, was successfully fabricated and the characteristics were compared with planar cell array transistors. In this experiment, a 1.6 times higher driving current of the fin array flash memory cell transistor is achieved than that of a planar device with the same gate length. We propose an optimized fin structure for flash memory operation and a direction for enhanced current of the fin array flash memory cell transistor with respect to the channel silicon plane, coupling ratio, junction profile and anti-punch through implantation conditions.
优化了FinFET阵列闪存的单元结构
本文成功制备了一种高可制造性的256 M体系三栅鳍阵列nor型快闪存储器,其鳍宽为70 nm,并与平面单元阵列晶体管进行了性能比较。在本实验中,在相同栅极长度的情况下,鳍阵列闪存单元晶体管的驱动电流比平面器件高1.6倍。我们提出了一种用于闪存工作的优化翅片结构,并通过注入条件,从通道硅平面、耦合比、结型和抗冲击等方面提出了翅片阵列闪存单元晶体管的增强电流方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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