Safety Measures And Their Cost Reduction Of Semiconductor Equipment

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI:10.1109/ISSM.1994.729436

T. Uchino, H. Shida

引用次数: 0

Abstract

Cost reduction of semiconductor equipment by streamlining safety measures is discussed. Unification of equipment specifications, elimination of over-specification, and maximum use of vendor options are the major guidelines for cost reduction. Consequently the average equipment price has decreased by 20%.

查看原文本刊更多论文

半导体设备的安全措施及其成本降低

讨论了通过简化安全措施来降低半导体设备的成本。统一设备规格，消除过度规格，最大限度地利用供应商选择是降低成本的主要指导方针。因此，设备的平均价格下降了20%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM

自引率

0.00%

发文量