Analysis of stub loaded microstrip patch antennas

M. D. Deshpande, ViGYAN Inc, Research Drive, Hampton M. C. Bailey
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引用次数: 12

Abstract

Rectangular and circular patch antennas loaded with a microstrip stub were previously analyzed using the generalized Thevenin theorem. In the Thevenin theorem approach, the mutual coupling between the patch current and the surface current on the stub was not taken into account. Also, the Thevenin theorem approach neglects continuity of current at the patch-stub junction. The approach presented in this present paper includes the coupling between the patch and stub currents as well as continuity at the patch-stub junction. The input impedance for a stub loaded microstrip patch is calculated by the general planar dielectric dyadic Green's function approach in the spectral domain. Using the spectral domain dyadic Green's function with the electric field integral equation (EFIE), the problem is formulated by using entire domain basis functions to represent the surface current densities on the patch, the loading stub and the attachment mode at the junction. Galerkin's procedure is used to reduce the EFIE to a matrix equation, which is then solved to obtain the amplitudes of the surface currents. These surface currents are then used for calculating the input impedance of stub loaded rectangular and circular stub loaded rectangular and circular microstrip patches. Numerical results are compared with measured results and with previous results calculated by the Thevenin's theorem approach.
短段加载微带贴片天线的分析
利用广义Thevenin定理对加载微带短段的矩形和圆形贴片天线进行了分析。在Thevenin定理方法中,没有考虑到贴片电流和表面电流之间的相互耦合。此外,Thevenin定理方法忽略了在patch-stub连接处电流的连续性。本文提出的方法包括贴片电流和短段电流之间的耦合以及贴片-短段连接处的连续性。在谱域用平面介质并矢格林函数法计算了短段加载微带贴片的输入阻抗。利用带电场积分方程(EFIE)的谱域并矢格林函数,用全域基函数来表示贴片、加载段和连接处的附着模式上的表面电流密度。采用伽辽金法将EFIE化简为矩阵方程,求解得到表面电流的幅值。这些表面电流然后用于计算短段加载矩形和圆形短段加载矩形和圆形微带贴片的输入阻抗。将数值结果与实测结果以及用Thevenin定理方法计算的结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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