High speed low cost BiCMOS for RF applications using profile engineering

G. Minghui, Zhao Haijun, A. Bandyopadhyay, C. Jiang, Foo Pang Dow
{"title":"High speed low cost BiCMOS for RF applications using profile engineering","authors":"G. Minghui, Zhao Haijun, A. Bandyopadhyay, C. Jiang, Foo Pang Dow","doi":"10.1109/ICSICT.1998.785845","DOIUrl":null,"url":null,"abstract":"This paper describes a low cost, CMOS foundry compatible BiCMOS process for 1.9 GHz RF applications. It keeps the simple feature of the triple-well single-poly approach while achieving much higher f/sub T/ by utilizing novel c-well profile engineering to reduce base and collector series resistance.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.785845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This paper describes a low cost, CMOS foundry compatible BiCMOS process for 1.9 GHz RF applications. It keeps the simple feature of the triple-well single-poly approach while achieving much higher f/sub T/ by utilizing novel c-well profile engineering to reduce base and collector series resistance.
高速低成本的射频应用BiCMOS采用轮廓工程
本文介绍了一种低成本、CMOS代工兼容的1.9 GHz射频应用BiCMOS工艺。它保留了三井单聚方法的简单特征,同时通过采用新颖的c井剖面工程来降低基极和集电极串联电阻,实现了更高的f/sub T/。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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